27th Electronics Packaging Technology Conference 에 참석하여 다음의 주제로 발표를 진행하였습니다.
– Junhyeok Park, Juheon Kim, Minki Jang, Juheon Kim, “A molecular dynamics study of grain size effects on Cu-Cu interfacial void reduction in hybrid bonding”
27th Electronics Packaging Technology Conference 에 참석하여 다음의 주제로 발표를 진행하였습니다.
– Junhyeok Park, Juheon Kim, Minki Jang, Juheon Kim, “A molecular dynamics study of grain size effects on Cu-Cu interfacial void reduction in hybrid bonding”